Description: With no-clean and lead free design, this solder flux paste has good environmental protection. The solder flux paste has excellent capacity of solder-stickiness and excellent anti-wet capacity, which is a necessary and helpful tool in BGA reballing. It is made of plastic and synthetic resin material. The length of this product is 7.2cm. The diameter of the product is 6.3cm. It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. Item Name: Solder Flux Paste Material: Plastic, Synthetic Resin Net Content: 100g Volatility: 300 Self Ignition Point: 387 Celsius Degree Specific Gravity: 1.05-1.08 Flash Point: 168F Flash Point: 92 Celsius Degree PH Value: 6.5 Applicable Temperature: 50-60 Celsius Degree Features: Low Residue, No-clean, Lead Free Size Details: Length: 7.2cm/2.83"(Approx.) Diameter: 6.3cm/2.48"(Approx.) Notes: Due to the light and screen setting difference, the item's color may be slightly different from the pictures. Please allow slight dimension difference due to different manual measurement. Package Includes: 1 Bottle of Solder Flux Paste