Features 1、APPLICABLE MODEL: This reballing stencil is suitable for A14 CPU, for IOS12, for IOS12MINI, for IOS12 Pro, for IOS12 Pro Maximum models. 2、UNIQUE DESIGN: The reball stencil is designed with multiple IC slots, which effectively prevent small IC from sticking tin and breaking corners. 3、PRECISE MADE: The reballing template is precisely made, which could accurately locate the accessory, provides high efficiency. 4、STAINLESS STEEL MATERIAL: The tin planting template is made from premium stainless steel, with high strength and strong toughness. 5、HIGH TEMPERATURE RESISTANT: The CPU reballing stencil will not easily changed or deformed under high temperature, more reliable to use. Specification Item Type: BGA Reballing Stencil Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For A14 Applicable Models: For IOS12, for IOS12MINI, for IOS12 Pro, for IOS12 Pro Maximum Package List 1 x BGA Reballing Stencil