Description: Ultra-small size; Support serial to WiFi; Wireless transparent transmission; Long distance transmission with ultra-low power; Bearing high temperature to 125 , compared to the 85 for ESP8266. Specification: SOC characteristics Built-in Tensilica L106 ultra-low power 32-bit CPU, main frequency 80MHz and160MHz, and RTOS; Built-in TCP/IP protocol; Built-in one-channel 10-bit high precision ADC; Outboard interface: , UART, I2C, I2S, IR Remote Controk, PWM, GPIO; Deep sleep current is 10uA, the cut-off current is smaller than 5uA; Wake,connect and transmission data package within 2ms; The consume power is smaller 1.0Mw (DTIM3) when at stand by status; Built in 1M byte for SPI Flash. WiFi characteristics Support 802.11 b/g/n/e/I; Support Station, Soft AP, Soft AP+STA mode; Support WiFi Direct (P2P); Support CCMP (CBC-MAC, computation mode), TKIP (MIC, RC4), WAPI (SMS4), WEP (RC4), CRC etc., for hardware acceleration. P2P finding, P2P / P2P power manage WPA/PA2PSK and WPS; 802.11 securitycertification: pre-certification and TSN Support 802.11n ( ); 802.1h/RFC1042 frame encapsulation; Support seam less roaming; Support AT remote update and cloud update (OTA); Support Smart Config function (including Android and Ios device). Module interface 2* UART; 1*ADC; 1*En; 1*wakeup pin; 1* ; 1*I2C; 1*I2S More than 10*GPIOs Working temperature: -40-+125; Module size:26.8mm*16mm Application:Electronical appliance; Smart power plug, smart light;Infant monitor;Sensor networks;Security ID label;Wireless location beacon;Home automation;Mesh networks; IP video camera;Wearable electronics;Wireless location recognition;Industrial wireless control. Package Includes: 1 Piece ESP-M3 Module